Under the Hood of Intelligent Systems

Podcast: EE Times Current · EE Times On Air

Opublikowano: 2026-06-27

Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven, challenges in bandwidth, latency, power, and interoperability intensify. In this episode, we unpack the interface technologies driving this evolution: from automotive SerDes to advanced imaging and next-gen connectivity.